TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking
For more information, contact Joel W. Sills, Langley Research Center, joel.w.sills@nasa.gov .
Failure Analyses Independent failure analyses concluded that the cracked chip resistors were due to bending/tensile failures. There was no clear-cut root cause or visible defect identifying a crack initiation site. Both resistors exhibited a single, straight crack across the short axis (perpendicular to the long axis), indicating a bending/tensile failure without twisting.
Guidelines for Assembly of Ceramic Body Components to Printed Circuit Boards The following guidelines are to be considered given the recent experience.
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